Thermal Interface Materials 101 – Enhanced Cooling for Electronic Systems
Boyd Boyd
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 Published On Feb 3, 2020

Consumer demand is hot for more compact, more powerful electronics. But the denser circuits required for smaller devices generate more heat, making higher performing thermal management materials a necessity. In this webinar, Boyd Corporation and 3M™ will focus on thermal management materials that quickly and efficiently dissipate heat, even within tight spaces.

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