This webinar dives into the cutting-edge technologies shaping the landscape of multilayer hybrid PCB (printed circuit board) designs, with a specific focus on high performance thermal laminate and prepreg materials. As electronic devices continue to evolve, the demand for PCBs with enhanced thermal management and reliability has become paramount. This webinar will provide a comprehensive overview of the characteristics, applications, and advantages of thermal laminate and prepreg materials in the context of hybrid PCBs.

The discussion covers fundamental properties of thermal laminate materials, highlighting their thermal conductivity, dielectric strength, and mechanical stability. Attendees will gain insights into how these materials contribute to the effective dissipation of heat in electronic assemblies, thus optimizing the overall performance and lifespan of electronic devices.

Furthermore, the webinar explores the role of thermal bond prepreg materials in hybrid PCB designs. Thermal prepregs, or pre-impregnated resin systems, play a crucial role in bonding layers of a PCB’s together to maximize thermal transfer reliably, and cost effectively. The session will elaborate on the different types of thermal bond and prepreg materials available, their resin content, and how they impact the overall reliability and manufacturability of hybrid PCB’s.