How to Reball BGA IC with SMD Stencil | IC Reballing easy Technique
Majid Goraya Majid Goraya
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 Published On Jun 6, 2023

Hi friends in this video we will know how to change any mobile phone ic. Espeically I will tell you how to reball ic. Ic reballing most defficult task in mobile phone repairing and ic replacement. This IC can be a CPU EMMC or power IC or any IC. It can be any mobile phone. But IC changing process remain the same for the all BGA ics. I will show you the complete guide step by step to change any smart phone BGA ic. IC changing process is so simple but it is very technical. We need to learn techniques for IC replacement. You should have very high quality and professional tools to transplant any ic. First thing you need is a BGA solder paste we can say it PPD paste and the Second thing you need is a BGA Stencil to apply the solder paste on the specific points. So it remain on its points and do not spread to other places. Then we need a SMD Rework Station, Soldering Iron, Soldering Wick, Soldering flux, Adhesive Tape and then process will begin. Magnifier lamp or Microscope Depends on ic size and the eye conditions of the person that is doing the process. In this video I used these things and try to successfully changed an IC of a mobile phone. In this video I will tell in detail how to change mobile phone power ic. How to change mobile phone CPU. How to change mobile phone EMMC. How to change Mobile phone SOC. After watching is video how your mind will be clear about this process. Thanks for watching Majid Goraya YouTube Channel.

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