We blend dendritic copper, graphene and micro diamond into epoxy to produce a thermally conductive adhesive. You can purchase the premixed epoxy at our website https://www.techingredients.com/shop

Thermal Epoxy (low viscosity infusion resin) formula using 3:1 epoxy

8:6:2:1
8g of epoxy
6g of dendritic copper
2g of graphene
1g of diamond

Ingredient sources:

Copper powder: Novamet Specialty Products, dendritic copper powder Lebanon, TN USA
2,000 grit diamond powder: TechDiamondTools.com, eBay store
Graphene: 5-10 layer powder from Ledmarket1997, eBay store

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and our website https://www.techingredients.com/